Re: EMI

To: tesla-at-pupman-dot-com
Subject: Re: EMI
From: "Robert W. Stephens" <rwstephens-at-ptbo.igs-dot-net>
Date: Wed, 25 Sep 1996 17:17:40 -0500
>From pierson-at-msd26.enet.dec-dot-comTue Sep 24 22:28:40 1996
>Date: Tue, 24 Sep 96 10:58:44 EDT
>From: pierson-at-msd26.enet.dec-dot-com
>To: mail11:  ;
>Cc: pierson-at-msd26.enet.dec-dot-com
>Subject: EMI

D. W. Pierson wrote:

<snip>

>	It was mentioned that stacking up multiple sheets of dielectric, to
>	get higher withstand voltages, created difficulties, in that the
>	sheets slid around.

>	Would it be possible/desirable to temporarily bond the sheets together,
>	say along one edge, to avoid this?  Using heat, or solvents, or
>	whatever, possibly even leaving an extra strip of dielectric for the
>	purpose?  Once the assembly was complete, the 'extra' strip might be
>	cut off, avoiding any potential (8)>>) problems with the eventual
>	voltage stress on the modified area?  (Or simply make the sheets
>	oversize, so that the 'bonded' area was outside the area subject to
>	high fields?)

>regards
>	dwp

D.W.

I suspect that such bonding treatment, along one edge of the 
capacitor to be rolled would cause two big problems that immediately 
come to mind.  Firstly the multi sheets of poly could not slide as 
they were rolled in a lengthwise fashion.  This would result in a 
completed pack that would be lumpy with great air voids.  Secondly, 
the sealed edge would make it very difficult to completely impregnate 
the rolled sandwhich with oil, many air bubble and voids would remain.
Sorry to be so pessimistic. : )
regards

rwstephens